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Ams Osram

Singapore / Global

Engineer, RD Packaging & Module Engineering

Job Description

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

Assist in integrating and optimizing end-to-end manufacturing process to meet product specifications and performance targets

Monitor process performance, yield trends and key quality indicators

Supporting root cause analysis and implement corrective actions for process and product-related issues

Working with process and product development engineers to create process flow and initial equipment list required in projects

Collaborate with cross-functional teams to resolve product or process-related issues

Developing and maintaining documentations like FMEA, machine and process buy-off document

Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering

Preferred 3 - 5 years in either R&D, packaging technologies, manufacturing.

Fresh graduates will be considered.

Experience in sensor module packaging and/or optical engineering will be an advantage.

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