Process Asssociate Engineer/Process Engineer

About the Client & Location

Our client is a global pioneer and high-tech pioneer in advanced semiconductor panel-level packaging and chiplet integration.

IMPORTANT NOTICE:

THIS IS A SINGAPORE-BASED ROLE.

Salary starting from SGD 3,000 – SGD 7,000

Position Overview

We are currently recruiting for both

Process Associate Engineer (PAE)

and

Process Engineer (PE)

positions.

In this role, you will be responsible for ensuring process integrity, optimizing production yields, and driving continuous improvement across advanced backend semiconductor operations (including Die Preparation, Molding, Die Pick & Place, Lithography, or SMT/Final Assembly).

Key Responsibilities

Line Sustaining & Process Integrity:

Ensure daily manufacturing process stability and machine integrity across assigned production modules.

Real-time Monitoring & SPC:

Monitor production processes via Statistical Process Control (SPC) charts and real-time defect tracking systems to detect trends or deviations.

Lot Disposition & Troubleshooting:

Handle on-hold lots, perform root-cause analysis, and execute corrective action/disposition for out-of-spec production lines.

Recipe Setup & Qualification:

Support the setup, tuning, and engineering qualification of production recipes for new product introductions (NPI) and process releases.

Continuous Improvement Projects:

Lead or assist in engineering yield enhancement, defect reduction, productivity improvements, and cost-reduction initiatives.

Documentation & Compliance:

Create and maintain standard operating procedures (SOP), work instructions (WI), FMEA, and qualification reports to ensure ISO/quality compliance.

Cross-Functional Support:

Collaborate closely with equipment engineers, quality teams, and production shift personnel to achieve module output targets.

Key Requirements

Education:

Minimum Diploma or Bachelor’s Degree in Electrical, Electronics, Mechatronics, Mechanical, Microelectronics, Chemical Engineering, Material Science, or related engineering discipline.

Industry Experience:

Prior hands-on experience in a

semiconductor manufacturing / cleanroom environment is strongly preferred .

Open to candidate levels:

PAE

(2–5 years of experience) and

PE

(>5 years of experience).

Technical Module Exposure:

Preferred experience in one or more of the following semiconductor backend processes:

Die Preparation:

Backgrind, Wafer Sawing/Dicing, Laser Grooving, Wafer Mounting, Taping/Detaping.

Molding & Debonding:

Compression, Transfer, or Injection Molding.

Die Pick & Place (PnP) .

Lithography / Advanced Packaging Steps .

General Assembly / SMT:

Pick & Place, Ball Mounting, Reflow, Laser Marking, Package Sawing, or Packing (Tray/TnR).

Technical Skills:

Familiarity with SPC, 8D problem-solving methodology, FMEA, and standard engineering documentation.

Shift Adaptability:

Must be flexible to work under various shift patterns.

Only shortlisted candidates will be notified.

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