Principal Engineer, AI-Driven Semiconductor Packaging

Job Description

Micron Technology, Inc. seeks a high-caliber engineer to develop and optimize wafer-level processes for high-performance memory manufacturing.

You will drive process development across photolithography, etch, CMP, deposition, and related steps, coordinating with global teams to meet performance and yield goals. The role emphasizes AI-enabled tooling, advanced process monitoring, and building robust POR/MOR documentation for smooth product transfers to production.

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Principal Engineer, AI-Driven Semiconductor Packaging

Job Description

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