AI-Driven Wafer Bonding Process Engineer

Job Description

Micron Technology, Inc. is seeking a Bonding Process & Equipment Engineer to drive startup, development, and optimization of wafer-to-wafer bonding processes.

You will collaborate with process integration, equipment engineering, suppliers, and global teams to improve yield, reduce costs, and ensure robust control plans. The role requires deep knowledge of bonding technologies (hybrid, dielectric, TSV-related), DOE/FMEA/SPC methodologies, and strong problem-solving skills to deliver reliable,

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AI-Driven Wafer Bonding Process Engineer

Job Description

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