Advanced Assembly Engineer (2.5-3D)

At Universal Quantum, we aim to make the world a better place by developing a new computer technology. Together, we are creating truly impactful quantum computers. Our machines will be capable of solving problems until now considered impossible, with applications ranging across a broad range of industries, including healthcare, materials and aerospace.

We are looking to hire an AdvancedAssemblyEngineer (2.5-3D)to develop, design,advanced assembly methods forquantum computers.

WhatYou’llAccomplish

Developassembly flows for various quantum computing devices

Drive methodology, innovation, and productivity improvements inassemblydevelopment internally and with external vendors

Initiateassemblyconcepts and lead advanced ICassemblydevelopment leveraging 2.5D and 3Dassemblytechnologies

Select and manage external partners to ensure successful execution

The 3 Most Critical AttributesWe’llUse to Compare Candidates

Deep Technical Expertise in semiconductorassembly, including 2.5D/3D integration and advanced ICassemblytechnologies

Problem-Solving Ability with strong engineering fundamentals and experience resolving complex reliability and performance challenges

Innovation and Leadership in driving new methodologies, collaborating with vendors, and improving design flows and productivity

Must-have Skills

Semiconductorassemblyexperience, including wafer-level 2.5D/3D packaging

Design for Excellence (DFM, DFT) experience

Knowledge ofcommon package technologies and materials

Familiarity with CAD tools and thermo-mechanical simulation.

Finite Element Modeling (FEM) for thermal, electrical, and mechanical simulations

Ability to resolveassemblyreliability issues across wide temperature ranges

Understandingsemiconductor assembly manufacturing and packaging/assemblyfailure mechanisms

Strong engineering problem-solving skills with solid physics fundamentals

PhD/master's degreein mechanical engineering, material science, physics, packaging, or micro/nanofabrication

Nice-to-have Skills

Development of technology PDKs

Knowledge of Through-Silicon Via (TSV), silicon processing, and thin-film techniques

Electro-mechanical testing at cryogenic temperatures

High-voltage/power package qualification experience

Process engineering background

#J-18808-Ljbffr