GMP Technologies
Singapore / Global
GET
The Big Jobsite
Singapore / Global
Responsibilities
Introduce customers new product to FAB and support in new products tape out procedures to ensure pilot success.
Improve new Product yield and ensure mass production inline, WAT and CP yield stable
Define standard operation procedure for daily job
Co-work with module engineers to solve production related issues. (inline, WAT, yield and reliability)
Co-work with module engineers to develop customized process to meet customer special requirement
Requirements
Possess at least a bachelors degree in Electronic Engineering, Electrical Electronic Engineering, Physics, Material Science
Study in specialized in wafer chip or related semiconductor course
Possess good communication skills
Possess good time management skills as well as a strong sense of commitment
Semiconductor device process engineer background is preferred
Semiconductor foundry experiences is preferred
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Fiona Koh | Registration No: R1109239
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