Assembly Engineer

Talent Link by e2i is a programme to match candidates to job opportunities offered by e2i’s Industry Partners. Applicable for Singaporeans and Singapore Permanent Residents only.

This job opportunity is from our Industry Partner in the Electronics sector.

Job Descriptions

• Lead and oversee microelectronics assembly processes, including die attach, wire bonding, equipment setup, and process optimization.
• Develop and qualify microelectronic packaging solutions, assembly processes, and documentation to support aerospace and defense products.
• Support new product development (NPD), prototype builds, first articles, and pre-production, ensuring designs are manufacturable.
• Work with RF ICs, substrates, capacitors, inductors, and other microelectronic components while ensuring compliance with quality and engineering standards.
• Train and mentor assembly personnel, drive continuous process improvements, and support products throughout their lifecycle.

Job Requirements

• Diploma/Degree in Electronics, Mechatronics, or a related Engineering discipline with 5-7 years of microelectronics assembly experience in a manufacturing environment.
• Strong knowledge of microelectronics assembly processes, packaging design, JEDEC/ISO standards, and operation of die attach, wire bonding, testing, and related assembly equipment.
• Able to interpret technical drawings, design assembly jigs, and preferably proficient in 2D/3D CAD software.
• Strong analytical, problem-solving, communication, and organizational skills with the ability to work independently and collaboratively.
• Comfortable working under a microscope using precision hand tools, with excellent attention to detail, steady hand-eye coordination, and the ability to distinguish colors.