BLESSED AGAPE CONNECTIONS PTE. LTD.
Singapore / Global
Singapore / Global
R&D Areas
R&D - Lithography
R&D - Underfill / Cure
R&D - Plating, PR Strip, Wet Etch
R&D - CA & TCB
Responsibilities
To design, qualify, and optimize advanced processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
Lead assigned projects.
Yield Improvement & Yield Failure Analysis (FA)
Technology Qualification & Transfer
Equipment & Material Evaluation
Requirements
Bachelor's degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials
R&D or mass production experience of at least three years in processes
Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel)
Strong analytical and problem-solving skills
Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions.
#J-18808-Ljbffr
Singapore / Global
Bukit Batok / Global
Singapore, Bukit Batok / Global
Singapore / Global
Singapore / Global
Singapore / Global