PDE PIE (Package Integration Engineering) Senior Engineer/Engineer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Key responsibilities and task:

To lead and manage the NPI activities as a Product Owner, working together with cross functional teams to accomplish organizational and business objectives by: Driving New Product Introduction process through NPI Phase Gate Review.

Coordinating new product start-up and to achieve first pass qualification.

Understand new product start-up datelines, product applications and customer requirements; and communicate this information to the new product start-up team Working with process / equipment / manufacturing / planning area owners to bring new product and package into volume production;

Providing timely support of First silicon, Engineering samples, Qual samples and meeting expectation on Engineering Hot lots cycle time as per PDT schedule.

Regular monitoring the product yield trend; QDR and reliability to ensure that assembly operation is in control and initiate early attention if necessary;

Owning the entire Product Life Cycle, from NPI to EOL. Understanding new product challenges and collaborate with Process / Equipment/Development owners to develop new technology capabilities ahead of market Acting as a point of contact to TPM on product related matters.

Requirements:

Masters or Bachelor's degree in an Engineering (Mechanical, Material, Chemical).

Min 8 years Experience in MNC semiconductor for mobile and automotive business.

Must have strong packaging knowledge in backend engineering process or package development.

Good technical knowledge in component test and/or module manufacturing process.

Familiar with package structures (eg. BGA, PoP) and package reliability concepts.

Excellent data analysis, statistical analysis, data interpretation skills.

Proficient in JMP analysis is a must.

Ability to make sound data-driven decisions.

Prioritize and apply due-diligence in day to day task.

Use AI assisted tool (e.g. copilot, as a productivity multiplier, not just a tool (e.g., faster root cause screening, smarter DOE design, automated reporting)

Equal Opportunity Employer

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

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