Senior / Engineer, Process Engineering (Advanced Packaging)

Job's mission

Build the foundation of nextgeneration semiconductor technologies.

What You Will Be Working On

Support the development and optimization of semiconductor processes for advanced packaging applications, including thinfilm deposition (ALD, PECVD, PVD, ECP) and surface preparation

Assist with planning and executing experiments, applying structured problem solving and basic DOE concepts

Collect, analyze, and document experimental data to support process learning and improvement

Develop new films or processes for emerging packaging applications like hybrid bonding and perform advanced materials characterization.

Perform hands‑on work with process equipment under guidance, including basic troubleshooting and tool characterization

Collaborate with cross‑functional teams such as equipment engineering, applications, and R&D to support process integration

Contribute to technical documentation, reports, and internal knowledge sharing

Learn and apply safe working practices in laboratory and cleanroom environments

What We Are Looking For

Ph. Ds or Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field. Bachelor's with strong research background can be considered.

Academic, internship, or project experience in semiconductor processing, materials science, or microelectronics

Familiarity with at least one thinfilm deposition or process technique (e.g., ALD, CVD, PECVD, PVD, electrochemical processes) through coursework or lab work

Exposure to hybrid bonding concepts, surface preparation, or integration topics through academic projects

Basic understanding of experimental methods, data analysis, or statistical concepts

Exposure to materials or surface characterization techniques through university labs or projects (e.g., SEM, AFM, XRD, ellipsometry)

Strong curiosity, learning mindset, and willingness to develop hands‑on technical skills

Ability to communicate clearly and work effectively in a collaborative, multicultural environment

What Sets You Apart

Internship, coop, or thesis experience related to semiconductor manufacturing or advanced packaging

Experience writing technical reports or presenting project results

Interest in working closely with complex equipment and understanding how processes translate to customer applications

Motivation to grow into deeper technical ownership and future engineering leadership

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identity or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

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