Technical Program Manager

We are looking for an experienced Technical Program Manager (TPM) who will be responsible for leading and executing multi-disciplinary engineering programs for a high-tech manufacturing environment . In this role, you will drive New Product Introduction (NPI), factory bring-up activities, process optimisation, and technical risk mitigation across the full manufacturing lifecycle, from prototype through to high-volume manufacturing (HVM).

Job Responsibilities

Lead the full technical program lifecycle for introducing new products into the manufacturing facility, coordinating milestones across product design, process engineering, and production teams

Apply hands-on knowledge of critical semiconductor packaging processes — including Die Bonding, Wire Bonding, and Active Alignment — to partner with engineering teams, translate technical specifications into manufacturing flows, and ensure smooth NPI handoffs to the factory floor

Proactively identify and mitigate cross-functional risks affecting production timelines, including component shortages (lasers, photodetectors, ICs) and equipment delays

Collaborate with quality and engineering teams to address technical bottlenecks , improve first-pass yield (FPY), and conduct root-cause analysis on manufacturing failures

Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking covering velocity, quality, capacity, and manufacturing yield

Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress and critical path updates

Champion operational excellence through standardisation across design, test, and production teams

Job Requirements

Bachelor's degree or above in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related discipline

More than 8 years of experience in electronics, semiconductor, or optical module manufacturing

More than 5 years in technical program management, engineering management, or technical project leadership within high-volume manufacturing environments

Experience in optical module or datacom manufacturing is preferred

Experience identifying and mitigating risks related to component supply, equipment readiness, and cross-functional dependencies

Strong understanding of semiconductor manufacturing processes , including SMT/PCBA, Die Bond, Wire Bond, Active Alignment, Assembly, Test, and Burn-in

Proven ability to manage NPI programs from prototype stage through to high-volume manufacturing

Understanding of cost modelling, BOM structure, capacity planning, and line readiness

Strong leadership and cross-functional coordination skills, with experience managing program dashboards and reporting

Possess a background in process standardisation and operational excellence initiatives across engineering and production teams

Familiarity with manufacturing metrics and quality frameworks , including FPY tracking, root-cause analysis, and yield improvement methodologies

Excellent communication skills with the ability to engage both internal stakeholders and external customers