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Peoplebank Asia

Singapore / Global

Senior Process Engineer (Dry Etch)

Job Description

Our client is a leading semiconductor manufacturer seeking a

Senior Process Engineer (Dry Etch)

to develop, optimize, and sustain etch processes in a high-volume wafer fabrication environment. This role is responsible for driving process capability, yield improvement, and equipment performance while supporting new technology development and continuous improvement initiatives.

RESPONSIBILITIES

Develop, optimize, and sustain Plasma Etch / Dry Etch processes to achieve production, yield, quality, and reliability targets.

Troubleshoot process and equipment issues, perform root cause analysis, and implement effective corrective actions to improve process stability.

Utilize SPC, DOE, and data analysis techniques to drive yield improvement, process capability enhancement, and continuous process optimization.

Collaborate with cross-functional teams to support new technology transfers, process qualifications, and continuous improvement initiatives focused on productivity, cycle time, and cost reduction.

REQUIREMENTS

Bachelor's Degree in Engineering, Physics, Materials Science, or related discipline.

3+ years of semiconductor process engineering experience in Plasma Etch or Dry Etch.

Strong knowledge of semiconductor fabrication processes, SPC, DOE, and failure analysis techniques.

Hands-on experience with process optimization, troubleshooting, and yield improvement.

Please note: Due to the anticipated high volume of applications, only shortlisted candidates will be contacted. All information provided will be treated with strict confidentiality and used solely for recruitment purposes.

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