ew elite search pte. ltd.
Singapore / Global
GET
The Big Jobsite
Singapore / Global
Key Responsibilities
Process Setup:
Program and optimize die-attach, eutectic, and thermo-compression bonding equipment.
Application Engineering:
Evaluate customer requirements, run feasibility studies, and manage sample fabrication for New Product Introduction (NPI).
Quality & Inspection:
Set up Automated Optical Inspection (AOI) programs and establish criteria to detect defects (voids, tilt, misalignment).
Yield Improvement:
Use DOE and SPC to resolve process variations, perform root-cause failure analysis, and write SOPs.
Required Qualifications
Education:
Degree in Mechanical, Electrical, Materials Engineering, or related fields.
Experience:
2+ years in semiconductor packaging or microelectronics assembly.
Technical Skills:
Hands-on experience programming bonding equipment and automated vision/inspection systems.
Tools:
Familiarity with failure analysis (shear testing, X-ray) and statistical software (Minitab/JMP).
Singapore / Global
Singapore / Global
Admiralty / Global
Singapore / Global
Singapore / Global
Singapore / Global