Packaging Design and SI/PI Engineer

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you're excited about building impactful technology in a dynamic, hands-on environment, we'd love to hear from you!

About The Role

We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.

What You'll Do

Own the design and layout of our micro-electronic package, the heart of our LyteCore system

Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package

Perform signal/power integrity simulation to optimize our package & system performance

Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.

Project tracking weekly.

Write technical reports and present results.

Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.

Required Qualifications

Minimal requirement is a bachelor's degree with 5 years of experience

Fluent in English communication, able to collaborate with teammates in different time zones

Experience in substrate design and packaging technology

Experience in signal and power integration simulation and interpretation of the results

Experience in EDA tools: Siwave, HFSS, APD, or similar

Maintain company confidential information are a must

Preferred Qualifications

Master's degree with more experience is highly desired

Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues

Experience with hands-on testing of electronic packages/systems.

Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.

Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.

Data analysis experience such as JMPs is a plus; excel is OK.

Programming and software maintenance skills are desired eg. python, or C++

Describe the experience and attributes of the ideal candidate

Benefits

(subject to location and local regulations)

Competitive salary and equity

Comprehensive medical, dental, and vision coverage

401(k) retirement plan

Flexible vacation and time-off policy

Collaborative, fast-paced, and inclusive work environment

Opportunity to work on cutting-edge technologies with a highly cross-functional team