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Micron

Singapore / Global

HBM Reliability & Test Engineering Lead

  • $180.000 - $280.000

Job Summary

Salary Range:
$180.000 - $280.000
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Job Description

Micron Technology, Inc. seeks a high-impact leader for the High Bandwidth Memory Product Engineering Media Health team in Singapore.

You will drive reliability test development and lead a cross-functional effort to reduce DPM and improve yield, quality, and cycle time across DRAM and interface die products. You will mentor engineers, manage complex qualification plans, and collaborate with Fab, TD, GQ, and System teams to deliver robust reliability solutions and cost-effective manufacturing

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