Principal Engineer, Advanced Packaging & AI

Job Description

Micron Technology, Inc. seeks a highly skilled engineer to advance assembly processes for wafer-level packaging, die stacking, and related advanced packaging workflows.

You will work with cross-functional teams—Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality—to optimize performance, cost, reliability, and manufacturability while enabling smooth product transfers to production.

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Micron

Principal Engineer, Advanced Packaging & AI

Job Description

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