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Broadcom

Bukit Merah / Global

Wafer Fab Process Engineer

Job Description

Job Description:

Job Summary

Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).

Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.

Drive new process integration (NPI) and process transfer to high-volume manufacturing.

Perform root cause analysis and implement robust corrective/preventive actions.

Define process control plans, SPC strategies, and OCAP execution.

Collaborate cross-functionally with equipment, integration, quality, and R&D teams.

Mentor junior engineers and technicians.

Interface with suppliers on process and material improvements.

Qualifications

Bachelor's or Master's degree in Engineering (Electrical, Chemical, Materials, or related).

At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).

Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.

Demonstrated leadership in cross-functional technical projects.

Strong analytical, problem-solving, and communication skills

Preferred

PhD in Engineering (Electrical, Chemical, Materials, or related).

Six Sigma certification (Green/Black Belt).

Experience supporting 4' to 6' wafer scaling or equivalent manufacturing transition.

R026529

Apply Now

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