Senior AI-Driven Packaging Engineer (2.5D/3D)

Job Description

Advanced Micro Devices in Singapore seeks an experienced Package Design Engineer to lead end‑to‑end packaging design for complex products. You will apply AI-driven design techniques and automation to address heterogeneous integration challenges, delivering high‑quality, scalable solutions.

The ideal candidate will own multiple design programs, mentor junior engineers, and collaborate with OSATs, foundries, and substrate vendors to optimize layouts and performance.

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Advanced Micro Devices

Senior AI-Driven Packaging Engineer (2.5D/3D)

Job Description

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