Packaging Process Engineer – 2.5D/3D IC Packaging

Job Description

ByteDance’s Silicon Platform Team serves as the core R&D middleware group for chip development, covering design, packaging, verification, and mass production deployment. The team interfaces with OSATs and fabs, driving process integration across 2D/2.5D/3D packaging technologies.

We seek candidates with a Master’s degree and hands-on experience in packaging, strong problem-solving skills, and a track record of cross-team collaboration to advance cutting-edge chip projects.

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Packaging Process Engineer – 2.5D/3D IC Packaging

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