Die Bond Process Engineer - Advanced Semiconductor Packaging

Job Description

Talent Recruitment Pte Ltd in Singapore is seeking an Applications / Process Engineer specializing in Die Bond Tools to join a multidisciplinary team. You will develop, optimize, and validate die bonding processes, set up equipment, and deliver on-site technical support.

The role requires a degree in Mechanical, Electrical, or Materials Engineering and at least three years in semiconductor packaging or die bonding.

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Die Bond Process Engineer - Advanced Semiconductor Packaging

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