Lead Process Engineer – Die Bonding & Semiconductor Packaging

Job Description

THE SUPREME HR ADVISORY PTE. LTD. in Woodlands North Coast, Singapore, is seeking a technically skilled engineer to lead the design, development, optimization, and validation of software and hardware for advanced die bonding processes.

This on-site role requires collaboration across R&D, software, mechanical, electrical, quality and manufacturing teams to deliver robust packaging solutions. You will analyze customer requirements, perform process optimization, and provide on-site support and

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THE SUPREME HR ADVISORY PTE. LTD.

Lead Process Engineer – Die Bonding & Semiconductor Packaging

Job Description

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