Associate Engineer - Wafer Bumping Process Engineering

Job Description

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UTAC

Line sustaining for wet processes (i.e. Metal Etch, Plating and PR Strip)

Support lot dispositions and OCAP executions

Working with QM Dept. to response customer inquires and issues

Execute CIP or project handling that contributes yield & cost efficiency improvement

Ensure SPC is maintain and in control

Support new material evaluation and new tool set up

Seniority level

Entry level

Employment type

Full-time

Job function

Manufacturing

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Associate Engineer - Wafer Bumping Process Engineering

Job Description

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