Entry-Level Wafer Bumping Process Engineer

Job Description

UTAC in Singapore invites applications for an Associate Engineer - Wafer Bumping Process Engineering. This entry-level role supports wet-process line activities including metal etch, plating and strip, with a focus on yield and cost efficiency.

You will work with QM for customer inquiries, assist CIP projects, maintain SPC, evaluate new materials, and set up new tools. Join a hands-on manufacturing team and grow in semiconductor packaging.

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UTAC

Entry-Level Wafer Bumping Process Engineer

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