Wire Bond Process Engineer — Quality & NPI Leader

Job Description

GMP Technologies (S) Pte Ltd in Singapore seeks a skilled materials/electronics engineer to develop and optimize wire bonding processes (gold, silver, copper). You will ensure the process capability meets customer specifications and participate in NPI/NPQ activities.

Responsibilities include failure analysis, SOP updates, audits, supplier qualification, training, and maintaining equipment. Requires 2–3 years in semiconductor assembly/test and knowledge of FMEA, ISO9001/QMS standards.

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GMP TECHNOLOGIES (S) PTE LTD

Wire Bond Process Engineer — Quality & NPI Leader

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