Process Engineer (Wire Bond)

Responsibilities

Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality

Ensure

wire bonding process

meets customer's specifications and requirements

Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure

Co-ordinate NPI and NPQ activities to meet given timeline

Qualify new product, material, device, and machinery

Participate in new tape development, and new material development activities

Perform supplier sourcing and qualification activities jointly with purchasing and engineering team

Benchmark new materials and new equipment technology in the market

Train co-workers on new process implementation and new machinery operations

Maintain, troubleshoot, and perform minor repair of assembly and test machinery

Develop new and update existing Standard Operating Procedures

Participate in internal audits, customers' audits and external audits

Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

Requirements

Degree or Diploma in Material Science / Electronics Engineering

Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT)

Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires

Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.

Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing

Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives

Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC

Good in problem solving, excellent interpersonal and communication skill

GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960

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