Process Engineer (Wire Bond)

Job Requirements

Degree or Diploma in Engineering (preferably in electronic or material Science)

Minimum 3 years working experience in a manufacturing environment (preferably in Semi-con assembly and test environment)

Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires

Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates .

Experience in IC assembly processes such as die attach, wire bond, encapsulation, and testing

Experience in maintenance of die attach, wire bond, encapsulation, and testing machinery

Able to multi-tasks and work in a fast-paced environment,

Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives

Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC

Good in problem solving, excellent interpersonal and communication skill

Job Description

Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality

Ensure wire bonding process meets customers specifications and requirements

Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure

Co-ordinate NPI and NPQ activities to meet given timeline

Qualify new product, material, device, and machinery

Participate in new tape development, and new material development activities

Perform supplier sourcing and qualification activities jointly with purchasing and engineering team

Benchmark new materials and new equipment technology in the market

Train co-workers on new process implementation and new machinery operations

Maintain, troubleshoot, and perform minor repair of assembly and test machinery

Develop new and update existing Standard Operating Procedures

Participate in internal audits, customers audits and external audits

Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

GMP Technologies (S) Pte Ltd | EA Licence 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960