Process Engineer: Die Attach, Wire Bond & Alignment

Job Description

Lumilens is seeking hands-on Process Engineers to support volume manufacturing ramp-up at our Bulim facility in Singapore. You will drive process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

Responsibilities include setting up processes, reducing defects, qualifying tooling and materials for high-volume ramp, and applying SPC/DOE to ensure stable, cost-efficient

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Process Engineer: Die Attach, Wire Bond & Alignment

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