Start Your Search Here

Job Search

GlobalFoundries inc.

Singapore / Global

Lead Process Engineer, Advanced Packaging

Job Description

GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join the 300mm Advance Packaging Center. You will develop and optimize diffusion/etch processes for multi-stack bond wafer and Die-to-Wafer workflows, starting up new processes while ensuring reliability and yield targets.

The role requires hands-on tooling start-up, collaboration with the equipment team, and ownership of process and tool performance in manufacturing.

#J-18808-Ljbffr

Apply Now

Similar Opportunities

View all jobs