Die Bond Process Engineer: Optimize Packaging Systems

Job Description

Talent Recruitment Pte Ltd is seeking an Application / Process Engineer (Die Bond Tools) in Woodlands, Singapore. The role focuses on developing, optimizing, and validating die bonding processes and equipment to achieve high production yields.

You will calibrate machines, troubleshoot issues, and work with R&D, software, mechanical, electrical, manufacturing and quality teams to drive product improvements. Travel to customer sites for installation and support may be required.

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Die Bond Process Engineer: Optimize Packaging Systems

Job Description

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Similar Opportunities

TALENT RECRUITMENT PTE. LTD.

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