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Lumilens Inc.

Singapore / Global

Process Engineer - Die Attach, Wire Bond & Active Alignment

Job Description

Lumilens Inc. in Singapore seeks hands-on Process Engineers to support our volume manufacturing ramp-up at the Bulim facility.

You will lead process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines. Ideal candidates bring 2+ years in semiconductor packaging or SMT, with domain expertise in Die Bond, Wire Bond, Active Alignment, or end-to-end process.

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